Aluminum nitride
Aluminum nitride (AlN) is the only material of technical ceramics that has a combination of very high thermal conductivity and excellent electrical insulating properties.
Main properties:
- high thermal conductivity;
- excellent electrical insulation properties;
- strength;
- low coefficient of thermal expansion;
- good metallization ability.
Main applications:
- blanks for ceramic printed circuit boards;
- substrates for metallization on thick-film and thin-film technologies;
- polished substrates for metallization on thin-film technology;
- substrates for LEDs;
- substrates for laser diodes;
- precision substrates for microwave GIS and microassemblies with a high density holes and indentations for crystals;
- multiple cards for sets of resistors, rheostats, fuel level sensors, pressure, etc.;
- carriers of schemes of poisonous substances, ionizing radiation, magnetic field sensors etc.;
- plates for ionizers and ozonizers of air;
- insulating pads for removing heat from electronic components to the cooling radiator;
- protectors for elements of piezoelectric transducers;
- bases and holders of flat heating elements, crystals of high-power semiconductor devices;
- plates for thermoelectric modules (Peltier elements);
- screens for radio frequency plasma generators;
- crucibles.
Basic properties of the material
| Properties | Material Grade |
| AlN | |
| Density, g/sm3 | 3,3 |
| Vickers hardness , GPa | 11 |
| Bending strength, MPa | 320 |
| Young modulus , GPa | 320 |
| Thermal conductivity, W/(m·K) | 180 |
| Coefficient of thermal liner expantion, 10-6/ºК | 4,7-5,6 |
| Electrical strength, kV/mm | 16 |
| Volume resistivity, Ohm·m | >1012 |
| Dielectric capacitivity | 8,9 |
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